Current-leveling electroplating/electropolishing electrode

A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base ele...

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Bibliographic Details
Main Authors Chang, Shih-Chieh, Wang, Ying-Lang, Chen, Kei-Wei, Lin, Shih-Ho, Chen, Chun-Chang
Format Patent
LanguageEnglish
Published 28.09.2010
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Summary:A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.