Molding apparatus and related methods

The invention relates to molding systems and related methods. In one aspect of the invention, a molding apparatus includes a first cylindrical roll that is rotatably coupled to a frame and an adjacent pressure device, the frame is configured so that a substrate can pass through a nip formed between...

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Bibliographic Details
Main Authors Clune, William P, Banker, Shawn C, Tachauer, Ernesto S
Format Patent
LanguageEnglish
Published 31.08.2010
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Summary:The invention relates to molding systems and related methods. In one aspect of the invention, a molding apparatus includes a first cylindrical roll that is rotatably coupled to a frame and an adjacent pressure device, the frame is configured so that a substrate can pass through a nip formed between the first cylindrical roll and the pressure device while a portion of the substrate extends laterally beyond at least the frame and the first cylindrical roll.