Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate

In a thin film semiconductor device realized on a flexible substrate, an electronic device using the same, and a manufacturing method thereof, the thin film semiconductor device and an electronic device include a flexible substrate, a semiconductor chip, which is formed on the flexible substrate, an...

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Main Authors Kim, Do-young, Park, Wan-jun, Park, Young-soo, Lee, June-key, Min, Yo-sep, Kwon, Jang-yeon, Seo, Sun-ae, Choi, Young-min, Chae, Soo-doo
Format Patent
LanguageEnglish
Published 03.08.2010
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Summary:In a thin film semiconductor device realized on a flexible substrate, an electronic device using the same, and a manufacturing method thereof, the thin film semiconductor device and an electronic device include a flexible substrate, a semiconductor chip, which is formed on the flexible substrate, and a protective cap, which seals the semiconductor chip. Durability of the thin film semiconductor device against stress due to bending of the substrate is improved by using the protective cap.