Semiconductor device and method of manufacturing the same
A semiconductor device includes: a semiconductor substrate; multiple active regions of a first conductive type isolated from one another by shallow-trench isolation regions provided on one surface of the semiconductor substrate; multiple silicon pillars including channel silicon pillars formed in th...
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Format | Patent |
Language | English |
Published |
30.03.2010
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Online Access | Get full text |
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Abstract | A semiconductor device includes: a semiconductor substrate; multiple active regions of a first conductive type isolated from one another by shallow-trench isolation regions provided on one surface of the semiconductor substrate; multiple silicon pillars including channel silicon pillars formed in the active regions; multiple first semiconductor regions of a second conductive type that are respectively formed on bottom ends of the silicon pillars and to be sources or drains; multiple second semiconductor regions of the second conductive type that are formed on top ends of the silicon pillars and to be sources or drains; multiple gate insulating films surrounding the silicon pillars; and multiple gate electrodes surrounding the gate insulating films. At least one of the channel silicon pillars has a height different from that of another one of the channel silicon pillars. |
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AbstractList | A semiconductor device includes: a semiconductor substrate; multiple active regions of a first conductive type isolated from one another by shallow-trench isolation regions provided on one surface of the semiconductor substrate; multiple silicon pillars including channel silicon pillars formed in the active regions; multiple first semiconductor regions of a second conductive type that are respectively formed on bottom ends of the silicon pillars and to be sources or drains; multiple second semiconductor regions of the second conductive type that are formed on top ends of the silicon pillars and to be sources or drains; multiple gate insulating films surrounding the silicon pillars; and multiple gate electrodes surrounding the gate insulating films. At least one of the channel silicon pillars has a height different from that of another one of the channel silicon pillars. |
Author | Oyu, Kiyonori |
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CorporateAuthor | Elpida Memory, Inc |
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References | (2007-134593) 20070500 Ishibashi (2003/0151068) 20030800 Tanaka (2007/0296045) 20071200 Seliskar (7211864) 20070500 Seliskar (2005/0056892) 20050300 (08-116068) 19960500 Masuoka et al. (2004/0262681) 20041200 |
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Snippet | A semiconductor device includes: a semiconductor substrate; multiple active regions of a first conductive type isolated from one another by shallow-trench... |
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Title | Semiconductor device and method of manufacturing the same |
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