Electroless deposition from non-aqueous solutions

A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.

Saved in:
Bibliographic Details
Main Authors Norkus, Eugenijus, Jaciauskiene, Jane, Dordi, Yezdi
Format Patent
LanguageEnglish
Published 30.03.2010
Online AccessGet full text

Cover

More Information
Summary:A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.