Micromechanical device and method for manufacturing a micromechanical device
In a method for manufacturing a micromechanical device having a region for forming an integrated circuit, at first a first layer is produced on a deeper-lying part in the substrate. Subsequently, a membrane layer is produced on the first layer and at least one channel completely penetrating the memb...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
16.03.2010
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| Online Access | Get full text |
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| Summary: | In a method for manufacturing a micromechanical device having a region for forming an integrated circuit, at first a first layer is produced on a deeper-lying part in the substrate. Subsequently, a membrane layer is produced on the first layer and at least one channel completely penetrating the membrane layer is introduced in the membrane layer. After that, a region of the first layer below the membrane layer is removed to form a cavity. Finally, the channel is sealed and a planar surface is formed. |
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