Electronic packages

Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant reg...

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Bibliographic Details
Main Authors Amin, Ahmed Nur, Bachman, Mark Adam, Crouthamel, David Lee, Osenbach, John William, Vaccaro, Brian Thomas
Format Patent
LanguageEnglish
Published 02.03.2010
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Summary:Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.