Semiconductor thin film using self-assembled monolayers and methods of production thereof

A semiconductor thin film using a self-assembled monolayer (SAM) and a method for producing the semiconductor thin film are provided. According to the semiconductor thin film, a uniform inorganic seed layer is formed by using the self-assembled monolayer so that the adhesion between an insulating la...

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Bibliographic Details
Main Authors Shin, Hyeon Jin, Chung, Young Su, Jeong, Hyun Dam, Hyun, Sang Heon, Seon, Jong Baek
Format Patent
LanguageEnglish
Published 15.12.2009
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Summary:A semiconductor thin film using a self-assembled monolayer (SAM) and a method for producing the semiconductor thin film are provided. According to the semiconductor thin film, a uniform inorganic seed layer is formed by using the self-assembled monolayer so that the adhesion between an insulating layer and a semiconductor layer is enhanced and thus the surface tension is reduced, thereby allowing the semiconductor thin film to have high quality without defects.