Method for forming wiring pattern, wiring pattern, and electronic apparatus
A method for forming a wiring pattern in which a plurality of electrical wirings deposited onto a substrate is conductively connected with each other through a plurality of conductive posts, the method including relatively moving a discharge head having a plurality of nozzles and a substrate in a pr...
Saved in:
| Main Authors | , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
08.12.2009
|
| Online Access | Get full text |
Cover
Loading…
| Summary: | A method for forming a wiring pattern in which a plurality of electrical wirings deposited onto a substrate is conductively connected with each other through a plurality of conductive posts, the method including relatively moving a discharge head having a plurality of nozzles and a substrate in a predetermined direction while discharging droplets from predetermined nozzles among the plural nozzles to form the plural conductive posts, wherein, in the orthogonal direction of the above-referenced predetermined direction, the interval among the plural nozzles "a" and the interval among the plural conductive posts "b" satisfy an equation "b=m×a" ("m" may be any positive integer). |
|---|