Insulating material for printed circuit board

Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from −300 to +300 ppm/° C. in the temperature range of −55˜125° C. and a dielectric constant ranging from 5...

Full description

Saved in:
Bibliographic Details
Main Authors Kim, Jin Cheol, Oh, Jun Rok, Kim, Tae Kyoung, Yoon, Sang Jun, Lee, Hwa Young
Format Patent
LanguageEnglish
Published 17.11.2009
Online AccessGet full text

Cover

More Information
Summary:Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from −300 to +300 ppm/° C. in the temperature range of −55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.