Electronic component package
b The present invention is to prevent melted sealant from flowing into the interior of a case of an electronic component package that is provided with a shielding electrode on the inner surface of the case, fill a through-hole with the sealant with reliability, and perform vacuum airtight sealing. T...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
07.07.2009
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| Online Access | Get full text |
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| Summary: | b The present invention is to prevent melted sealant from flowing into the interior of a case of an electronic component package that is provided with a shielding electrode on the inner surface of the case, fill a through-hole with the sealant with reliability, and perform vacuum airtight sealing. The electronic component package has a case that has an opening and stores an electronic component (piezoelectric oscillator ) in the storage inside, and a lid that is joined to the rim of the opening to cover the opening, and airtightly seals a through-hole provided on the bottom part of the case to communicate with the outside, by using a sealant . The electronic component package is provided with a shielding electrode on the inner surface of the case to remove a noise influence, and further provided with a configuration to set a part (nonmetal part ) between the through-hole and the shielding electrode , the part being low in wettability with the melted sealant , thereby making it difficult to flow the melted sealant from the through-hole into the case along the shielding electrode , preventing the melted sealant from flowing into the case |
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