Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating

A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal d...

Full description

Saved in:
Bibliographic Details
Main Authors Gebhart, Lawrence E, Sun, Jenny J, Miller, Phillip O, Taylor, E. Jennings
Format Patent
LanguageEnglish
Published 30.06.2009
Online AccessGet full text

Cover

More Information
Summary:A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.