Polishing pad

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optiona...

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Bibliographic Details
Main Authors Vangsness, Jean, Hsu, Oscar Kai Chi, Potnis, Alaka
Format Patent
LanguageEnglish
Published 19.05.2009
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Summary:An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.