Array quad flat no-lead package and method of forming same

• Main Authors: Lo, Wai Yew, Yip, Heng Keong
• Format: Patent
• Language: English
• Published: 12.05.2009

An array QFN package includes a first semiconductor package and a lead frame having a plurality of leads. A first IC die is attached on a first side to the first semiconductor package and is electrically connected to the leads of the lead frame. A mold compound encapsulates the first IC die, a porti...