Array quad flat no-lead package and method of forming same

An array QFN package includes a first semiconductor package and a lead frame having a plurality of leads. A first IC die is attached on a first side to the first semiconductor package and is electrically connected to the leads of the lead frame. A mold compound encapsulates the first IC die, a porti...

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Bibliographic Details
Main Authors Lo, Wai Yew, Yip, Heng Keong
Format Patent
LanguageEnglish
Published 12.05.2009
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Summary:An array QFN package includes a first semiconductor package and a lead frame having a plurality of leads. A first IC die is attached on a first side to the first semiconductor package and is electrically connected to the leads of the lead frame. A mold compound encapsulates the first IC die, a portion of the first semiconductor package and a portion of the leads such that a plurality of I/O terminals on the semiconductor package is exposed.