Method of inspecting a substrate using ultrasonic waves and apparatus for performing the same

A method of inspecting a substrate is provided comprising applying ultrasonic waves to a substrate, receiving echo pulse signals transmitted through the substrate, and analyzing received echo pulse signals to detect defects in the substrate. Thus, defects in the substrate may be detected.

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Bibliographic Details
Main Authors Kim, Kwang-Soo, Jun, Chung-Sam
Format Patent
LanguageEnglish
Published 05.05.2009
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Summary:A method of inspecting a substrate is provided comprising applying ultrasonic waves to a substrate, receiving echo pulse signals transmitted through the substrate, and analyzing received echo pulse signals to detect defects in the substrate. Thus, defects in the substrate may be detected.