Multichip package system
A multichip package system is provided forming a substrate having a plurality of molding transfer channel, connecting a first integrated circuit die on a top side of the substrate, connecting a second integrated circuit die on a bottom side of the substrate, and concurrently encapsulating the first...
Saved in:
| Main Authors | , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
21.04.2009
|
| Online Access | Get full text |
Cover
Loading…
| Summary: | A multichip package system is provided forming a substrate having a plurality of molding transfer channel, connecting a first integrated circuit die on a top side of the substrate, connecting a second integrated circuit die on a bottom side of the substrate, and concurrently encapsulating the first integrated circuit die and the second integrated circuit die with a molding compound flow through the plurality of the molding transfer channels. |
|---|