Multiple die stack apparatus employing T-shaped interposer elements
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed.
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
14.04.2009
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| Online Access | Get full text |
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| Summary: | Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. |
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