Semiconductor module and power conversion device

One method of achieving the above subjects is by connecting a block member , which is connected to the side opposite to that of a semiconductor chip having insulating substrates and connected to the top and bottom of the semiconductor chip , to a block member across an laminated structure constitute...

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Main Authors Yoshizaki, Atsuhiro, Mashino, Keiichi, Anan, Hiromichi, Ochiai, Yoshitaka
Format Patent
LanguageEnglish
Published 24.03.2009
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Abstract One method of achieving the above subjects is by connecting a block member , which is connected to the side opposite to that of a semiconductor chip having insulating substrates and connected to the top and bottom of the semiconductor chip , to a block member across an laminated structure constituted by the semiconductor chip and the insulating substrates and
AbstractList One method of achieving the above subjects is by connecting a block member , which is connected to the side opposite to that of a semiconductor chip having insulating substrates and connected to the top and bottom of the semiconductor chip , to a block member across an laminated structure constituted by the semiconductor chip and the insulating substrates and
Author Mashino, Keiichi
Yoshizaki, Atsuhiro
Anan, Hiromichi
Ochiai, Yoshitaka
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References (2001-156225) 20010600
Nakase et al. (6538308) 20030300
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Liu et al. (6442033) 20020800
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Patel (5396403) 19950300
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Title Semiconductor module and power conversion device
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