Semiconductor module and power conversion device
One method of achieving the above subjects is by connecting a block member , which is connected to the side opposite to that of a semiconductor chip having insulating substrates and connected to the top and bottom of the semiconductor chip , to a block member across an laminated structure constitute...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
24.03.2009
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| Online Access | Get full text |
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| Summary: | One method of achieving the above subjects is by connecting a block member , which is connected to the side opposite to that of a semiconductor chip having insulating substrates and connected to the top and bottom of the semiconductor chip , to a block member across an laminated structure constituted by the semiconductor chip and the insulating substrates and |
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