Multilayer interconnection board
A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0<L(L/3) is set, where L de...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
13.01.2009
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| Online Access | Get full text |
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| Summary: | A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0<L(L/3) is set, where L denotes the distance between center positions of a pair of neighboring via forming parts formed in the same insulation layer and L denotes the shortest separation distance between the pair of the via forming parts. |
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