Method and apparatus for diverting void diffusion in integrated circuit conductors

A method of diverting void diffusion in an integrated circuit includes steps of forming an electrical conductor having a boundary in a first electrically conductive layer of an integrated circuit, forming a via inside the boundary of the electrical conductor in a dielectric layer between the first e...

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Main Authors Allman, Derryl D. J, Bhatt, Hemanshu D, May, Charles E, Burke, Peter Austin, Kwak, Byung-Sung, Sun, Sey-Shing, Price, David T, Pritchard, David
Format Patent
LanguageEnglish
Published 14.10.2008
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Summary:A method of diverting void diffusion in an integrated circuit includes steps of forming an electrical conductor having a boundary in a first electrically conductive layer of an integrated circuit, forming a via inside the boundary of the electrical conductor in a dielectric layer between the first electrically conductive layer and a second electrically conductive layer of the integrated circuit, and forming a slot between the via and the boundary of the electrical conductor for diverting void diffusion in the electrical conductor away from the via.