Semiconductor device

• Main Authors: Yamamoto, Saiki, Nii, Ikuya, Ukawa, Hiroaki
• Format: Patent
• Language: English
• Published: 07.10.2008

The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.The semiconductor device of the present invention comprises a semiconductor element having a pair of electrodes, a housing having the recess for accommodating the semiconductor element , a first lead electrode and the second lead electrode which are exposed on the bottom of the recess , an adhesive layer for die bonding between the semiconductor element and the first lead electrode , and electrically conductive wires for wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrode and between the other electrode and the second lead electrode , wherein the housing has the wall formed to extend across the bottom surface of the recess so as to divide the surface of the first lead electrode into a die bonding area and a wire bonding area , and the first lead electrode has the notch which is formed by cutting off a portion of an edge of the first lead electrode and located at least just below the wall , while the wall and the bottom portion of the housing are connected to each other through the notch