Method of cross-section milling with focused ion beam (FIB) device
A method of milling a cross section of a wafer and a milling device. The method includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame. The milling device is adapted to cross-section milling of a wafer, said milling includes a coarse scanning of a...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
23.09.2008
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| Online Access | Get full text |
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| Summary: | A method of milling a cross section of a wafer and a milling device. The method includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame. The milling device is adapted to cross-section milling of a wafer, said milling includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame. |
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