Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

A method of making a circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not incl...

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Bibliographic Details
Main Authors Japp, Robert M, Memis, Irving, Papathomas, Kostas I
Format Patent
LanguageEnglish
Published 26.08.2008
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Summary:A method of making a circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof.