Semiconductor package having enhanced heat dissipation and method of fabricating the same
A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semic...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
17.06.2008
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| Online Access | Get full text |
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| Summary: | A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semiconductor chip package is also provided. |
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