Resin encapsulated semiconductor device and the production method

• Main Authors: Suzuki, Kazuhiro, Morita, Toshiaki, Imamura, Hisayuki, Watanabe, Junichi, Chiba, Mitsuaki
• Format: Patent
• Language: English
• Published: 13.05.2008

a a a. a b a a a a, A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate is bonded to the surface side of the silicon nitride plate and a prescribed circuit pattern is formed on the copper plate Tin-silver-copper cream solder layers and with a thickness of 200 μm are formed at a prescribed location on the circuit pattern on which a semiconductor element is mounted and at a prescribed location of a base plate on which the circuit board is disposed. Nickel particles having a maximum particle size of 100 μm and an average particle size of 70 μm are dispersed in the solder on the base plate of good thermal conductivity. A semiconductor element (chip) the circuit board and the base plate are disposed on predetermined locations. Thereafter, they are set in a reflow oven (not shown in the drawings) for reflow soldering. After the inside of the reflow oven is replaced by a nitrogen atmosphere, the reflow oven is heated to 280° C. At the time when solder is melted, the inside of the oven is decompressed to 1 Pa, nitrogen is introduced, and the reflow oven is cooled to about room temperature, thereby completing the solder bonding step. After flux is washed, an outer case with an insert-molded outlet terminal is adhered to the base plate and a predetermined connection is conducted via an aluminum bonding wire Then, silicone gel is injected into a package delimited via the base plate and the outer case and the silicone gel is heat-hardened, thereby completing a resin encapsulated semiconductor device A.