Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design

A method and apparatus for redirecting void diffusion away from vias in an integrated circuit design includes steps of forming an electrical conductor in a first electrically conductive layer of an integrated circuit design, forming a via between a distal end of the electrical conductor and a second...

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Main Authors Allman, Derryl D. J, Bhatt, Hemanshu D, May, Charles E, Burke, Peter Austin, Kwak, Byung-Sung, Sun, Sey-Shing, Price, David T, Pritchard, David
Format Patent
LanguageEnglish
Published 22.04.2008
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Summary:A method and apparatus for redirecting void diffusion away from vias in an integrated circuit design includes steps of forming an electrical conductor in a first electrically conductive layer of an integrated circuit design, forming a via between a distal end of the electrical conductor and a second electrically conductive layer of the integrated circuit design, and reducing tensile stress in the electrical conductor to divert void diffusion away from the via.