Lead-free copper alloy and a method of manufacture

A lead-free copper alloy based on Cu-Zn-Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01...

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Bibliographic Details
Main Authors Hofmann, Uwe, Dannenmann, Wolfgang, Breu, Monika, Schmid, Guenter, Seeger, Joerg
Format Patent
LanguageEnglish
Published 08.04.2008
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Summary:A lead-free copper alloy based on Cu-Zn-Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.