Apparatus for uniformly etching a dielectric layer

Apparatus for plasma etching a layer of material upon a substrate comprising an anode having a first region protruding from a second region, wherein the second region defines a plane and the first region extends from said plane. In one embodiment, at least one solenoid is disposed near the apparatus...

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Bibliographic Details
Main Authors Doan, Kenny L, Kim, Yunsang, Dahimene, Mahmoud, Liu, Jingbao, Pu, Bryan, Shan, Hongqing, Curry, Don
Format Patent
LanguageEnglish
Published 08.01.2008
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Summary:Apparatus for plasma etching a layer of material upon a substrate comprising an anode having a first region protruding from a second region, wherein the second region defines a plane and the first region extends from said plane. In one embodiment, at least one solenoid is disposed near the apparatus to magnetize the plasma.