Assembly with a ring and bonding pads formed of a same material on a substrate

An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.

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Bibliographic Details
Main Authors Craig, David M, Chen, Chien-Hua, Haluzak, Charles C, Yenchik, Ronnie J
Format Patent
LanguageEnglish
Published 28.08.2007
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Summary:An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.