Three-dimensional package

An electronic device including a first integrated circuit (IC) die electrically connected to a first lead frame and a second IC die electrically connected to a second lead frame. The first lead frame is electrically connected to the second lead frame by at least one stud bump, which is selectively f...

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Bibliographic Details
Main Authors Shiu, Hei Ming, Chau, On Lok, Wong, Fei Ying
Format Patent
LanguageEnglish
Published 28.08.2007
Online AccessGet full text

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