Three-dimensional package

An electronic device including a first integrated circuit (IC) die electrically connected to a first lead frame and a second IC die electrically connected to a second lead frame. The first lead frame is electrically connected to the second lead frame by at least one stud bump, which is selectively f...

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Bibliographic Details
Main Authors Shiu, Hei Ming, Chau, On Lok, Wong, Fei Ying
Format Patent
LanguageEnglish
Published 28.08.2007
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Summary:An electronic device including a first integrated circuit (IC) die electrically connected to a first lead frame and a second IC die electrically connected to a second lead frame. The first lead frame is electrically connected to the second lead frame by at least one stud bump, which is selectively formed where an electrical connection between the first lead frame and the second lead frame is required. The first and second lead frames and, the first and second IC dies and, and the at least one stud bump are encapsulated by a mold compound to form a 3D package.