Alignment system and method and device manufactured thereby

An arrangement for and a method of automatically selecting substrate alignment marks on a substrate in a lithographic apparatus or overlay metrology targets in an overlay metrology apparatus. The apparatus has a processor and a memory connected to the processor. The memory stores locations of one or...

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Main Authors Tolsma, Hoite Pieter Theodoor, Navarro Y Koren, Ramon, Simons, Hubertus Johannes Gertrudus, Edart, Remi Daniel Marie, Lam, Pui Leng, Hulshof, Bernardus Johannes Antonius, Bogers, Roland Adrianus Emanuel Maria
Format Patent
LanguageEnglish
Published 21.08.2007
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Summary:An arrangement for and a method of automatically selecting substrate alignment marks on a substrate in a lithographic apparatus or overlay metrology targets in an overlay metrology apparatus. The apparatus has a processor and a memory connected to the processor. The memory stores locations of one or more sets of substrate alignment marks or overlay metrology targets available for selection and selection rules to select suitable substrate alignment marks or overlay metrology targets from this at least one set. The selection rules are based on experimental or theoretical knowledge about which substrate alignment mark or overlay metrology targets locations are optimal in dependence on one or more selection criteria.