Semiconductor device package with reduced leakage

A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating in...

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Main Authors Carberry, Patrick Joseph, Gilbert, Jeffery John, Libricz, Jr, George John, Moyer, Ralph Salvatore, Osenbach, John William, Safar, Hugo Fernando, Shilling, Thomas Herbert
Format Patent
LanguageEnglish
Published 29.05.2007
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Abstract A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewalls interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.
AbstractList A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewalls interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.
Author Osenbach, John William
Libricz, Jr, George John
Carberry, Patrick Joseph
Shilling, Thomas Herbert
Gilbert, Jeffery John
Safar, Hugo Fernando
Moyer, Ralph Salvatore
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Snippet A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead...
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Title Semiconductor device package with reduced leakage
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