Semiconductor device package with reduced leakage

A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating in...

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Bibliographic Details
Main Authors Carberry, Patrick Joseph, Gilbert, Jeffery John, Libricz, Jr, George John, Moyer, Ralph Salvatore, Osenbach, John William, Safar, Hugo Fernando, Shilling, Thomas Herbert
Format Patent
LanguageEnglish
Published 29.05.2007
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Summary:A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewalls interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.