Apparatus and method for flattening a warped substrate

12N 12N12N 1N12N 12NV1V2VN 12N12N 12N 12NV1V2VN 12NN+112NN+1A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface r...

Full description

Saved in:
Bibliographic Details
Main Authors Fayaz, Mohammed F, Kaldor, Steffen K, Murray, Conal E, Noyan, Ismail C, Petrosky, Anne L
Format Patent
LanguageEnglish
Published 08.05.2007
Online AccessGet full text

Cover

More Information
Summary:12N 12N12N 1N12N 12NV1V2VN 12N12N 12N 12NV1V2VN 12NN+112NN+1A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface regions S, S, . . . , Shaving an average warpage of W, W, . . . , W, respectively, wherein W≦W≦ . . . ≦Wand W≦W. Zones Z, Z, . . . , Zof the planar surface respectively comprise vacuum port groups G, G, . . . , G. Each group comprises at least one vacuum port. N is at least 2. A vacuum pressure P, P, . . . , Pis generated at each vacuum port within group G, G, . . . , G, at a time of T, T, . . . , Tto clamp surface region S, S, . . . , Sto zone Z, Z, . . . , Z, respectively. The vacuum pressure P, P, . . . , Pis maintained at the vacuum ports of group G, G, . . . , G, respectively, until time T. T<T< . . . <T<T.