Retainer ring, Polishing head, and chemical mechanical polishing apparatus

A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical...

Full description

Saved in:
Bibliographic Details
Main Author Han, Ja-hyung
Format Patent
LanguageEnglish
Published 08.05.2007
Online AccessGet full text

Cover

Loading…
More Information
Summary:A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical mechanical polishing apparatus including a polishing pad formed on a platen and a polishing head including a retainer ring.