Retainer ring, Polishing head, and chemical mechanical polishing apparatus
A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
08.05.2007
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| Online Access | Get full text |
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| Summary: | A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical mechanical polishing apparatus including a polishing pad formed on a platen and a polishing head including a retainer ring. |
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