Package warpage control

A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate havi...

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Bibliographic Details
Main Authors Lee, Michael Keat Lye, Loke, Mun Leong, Ong, Soon Chuan, Teng, Hooi Jin, Lee, Lisa Yung Hui, Hasan, Altaf
Format Patent
LanguageEnglish
Published 24.04.2007
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Summary:A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.