Method of managing a plating liquid used in a plating apparatus

• Main Authors: Isayama, Yasushi, Ueyama, Hiroyuki, Kaneko, Hiroyuki, Yamakawa, Junitsu, Hongo, Akihisa, Kimizuka, Ryoichi, Maruyama, Megumi
• Format: Patent
• Language: English
• Published: 06.02.2007

The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plat...