Method of managing a plating liquid used in a plating apparatus

The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plat...

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Bibliographic Details
Main Authors Isayama, Yasushi, Ueyama, Hiroyuki, Kaneko, Hiroyuki, Yamakawa, Junitsu, Hongo, Akihisa, Kimizuka, Ryoichi, Maruyama, Megumi
Format Patent
LanguageEnglish
Published 06.02.2007
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Summary:The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.