Stabilizing fluorine etching of low-k materials

Damascene processing is implemented with dielectric barrier films for improved step coverage and reduced contact resistance. Embodiments include the use of two different dielectric films to avoid misalignment problems. Embodiments further include dual damascene (A, B) processing using Cu metallizati...

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Bibliographic Details
Main Authors Yang, Kai, Erb, Darrell M, Wang, Fei
Format Patent
LanguageEnglish
Published 07.11.2006
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Summary:Damascene processing is implemented with dielectric barrier films for improved step coverage and reduced contact resistance. Embodiments include the use of two different dielectric films to avoid misalignment problems. Embodiments further include dual damascene (A, B) processing using Cu metallization.