Protective tape removing apparatus and method of assembling semiconductor package using the same
A method of utilizing a removable protective tape to protect the active surfaces of semiconductor wafer and the individual semiconductor chips during semiconductor packaging processes is provided along with several configurations of apparatuses that may be used in such a method for removing protecti...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
31.10.2006
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| Online Access | Get full text |
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| Summary: | A method of utilizing a removable protective tape to protect the active surfaces of semiconductor wafer and the individual semiconductor chips during semiconductor packaging processes is provided along with several configurations of apparatuses that may be used in such a method for removing protective tape portions from individual semiconductor chips during the assembly process. |
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