Fabrication method for microstructures with high aspect ratios

A fabrication method for microstructures with high aspect ratios uses a CMOS process to form a desired microstructure on a silicon substrate. The steps of forming a contact plug and a via plug of the process are used to form etching channels in insulation layers, polysilicon layers and metal layers,...

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Bibliographic Details
Main Authors Kuo, Nai-Hao, Yen, Kai-Hsiang, Chiou, Jing-Hung, Tsai, Po-Hao, Lee, Yuh-Wen
Format Patent
LanguageEnglish
Published 24.10.2006
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Summary:A fabrication method for microstructures with high aspect ratios uses a CMOS process to form a desired microstructure on a silicon substrate. The steps of forming a contact plug and a via plug of the process are used to form etching channels in insulation layers, polysilicon layers and metal layers, penetrating to the silicon substrate. An etching process is then performed through the etching channel to form the desired microstructure with high aspect ratio.