Flipchip QFN package

A semiconductor device includes a first leadframe having a perimeter that defines a cavity and leads extending inwardly from the perimeter, and a second leadframe having top and bottom surfaces and a die paddle surrounding a die receiving area. An integrated circuit is placed within the die receivin...

Full description

Saved in:
Bibliographic Details
Main Authors Shiu, Hei Ming, Chow, Wai Wong, He, Qing-Chun
Format Patent
LanguageEnglish
Published 26.09.2006
Online AccessGet full text

Cover

More Information
Summary:A semiconductor device includes a first leadframe having a perimeter that defines a cavity and leads extending inwardly from the perimeter, and a second leadframe having top and bottom surfaces and a die paddle surrounding a die receiving area. An integrated circuit is placed within the die receiving area of the second leadframe. The IC has bonding pads located on a peripheral portion of its top surface. The second leadframe and the IC are in facing relation with the first leadframe such that the leads of the first leadframe are electrically connected to respective ones of the bonding pads. A mold compound is injected between the first and second leadframes and covers the second leadframe top surface and a central area of the first surface of the IC. At least the bottom surfaces of the leads are exposed.