Polishing solution and method of polishing nonferrous metal materials

• Main Authors: Suzuki, Youichiro, Arita, Satoru, Fukui, Hirokazu, Tsuchiya, Kazuyo
• Format: Patent
• Language: English
• Published: 15.08.2006

−1 3 A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10to 10and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribut...