Polishing solution and method of polishing nonferrous metal materials

−1 3 A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10to 10and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribut...

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Bibliographic Details
Main Authors Suzuki, Youichiro, Arita, Satoru, Fukui, Hirokazu, Tsuchiya, Kazuyo
Format Patent
LanguageEnglish
Published 15.08.2006
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Summary:−1 3 A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10to 10and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform.