Method for handling integrated circuit die

In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.

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Bibliographic Details
Main Authors Lu, Daoqiang, Rumer, Christopher L
Format Patent
LanguageEnglish
Published 13.06.2006
Online AccessGet full text

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Summary:In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.