Semiconductor integrated circuit device and method of manufacturing the same
A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
02.05.2006
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Online Access | Get full text |
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