Method of forming dual damascene interconnection using low-k dielectric material

• Main Authors: Kim, Jae-Hak, Lee, Soo-Geun, Park, Ki-Kwan, Lee, Kyoung-Woo
• Format: Patent
• Language: English
• Published: 04.04.2006

In order to avoid a faulty pattern resulting from a photoresist tail being formed due to a step difference of an upper hard mask layer when a dual hard mask layer is used, a planarization layer is formed following patterning of the upper hard mask layer. In this manner, a photoresist pattern is formed without the creation of a photoresist tail. Alternatively, a single hard mask layer and a planarization layer are substituted for the dual lower hard mask layer and an upper hard mask layer, respectively. In this manner, it is therefore possible to form a photoresist pattern without a photoresist tail being formed during photolithographic processes. In order to prevent formation of a facet, the planarization layer is thickly formed or, alternatively, the hard mask layer is etched using the photoresist pattern.